Apple Inc. (NASDAQ: AAPL) — If rumours are to be believed, Apple iPhone 7 and 7 Plus will not be launched in the fall of 2016. However, there are widespread reports of the specifications and features which will be available with the upcoming iPhone. While the S in the previous iPhone releases denotes minor upgrade than its earlier counterparts, the upcoming iPhone will not feature the S mention.
In 2015, we saw improved camera and a better processor, but the upcoming iPhone version is expected to feature new design coupled with enhanced features.
Even though it’s too early to comment since Apple is reportedly working on the design of iPhone 7, a reliable source confirmed to us that the new device will make use of a design similar to that of the iPhone 6s but without a rear protruding camera and antenna bands on the back of the device.
Apple iPhone 7 and iPhone 7 Plus are expected to be powered by the next-generation A10 processors manufactured by TSMC and will be built using a new composite material that improves the water resistance of the device.
While iPhone 7 is expected to incorporate a 4.7-inch OLED display with 2GB RAM, the iPhone 7 Plus will likely offer a 5.5-inch OLED display paired with 3GB RAM. Both the devices will integrate in-cell panel technology display with support for 3D touch and lightning port.
Apple iPhone 7 Plus is expected to house a 12-megapixel dual-lens camera system with LinX technology. The new camera sensor is said to be capable of producing DSLR-like image quality with 2-3x optical zoom and improved performance in low lighting conditions. However, we don’t have any information as far as iPhone 7 camera is concerned, but we expect it to include high-end features.
That being said, the front-facing camera is both the devices will have at least 8-megapixel camera sensor with flash support although it’s too early to comment.
According to rumors, there will be a refinement in the power department with the possible introduction of wireless charging technology in both iPhone 7 and iPhone 7 Plus.
By removing the 3.5mm headphone jack, Apple aims to not only cut the thickness of iPhone 7 to resemble 6.1mm iPod touch but also more room for other components. According to a reliable source, a secondary speaker with Dolby audio will probably find a place in place of the headphone jack.
Apple is expected to bundle Lightning-equipped EarPods along with the package. Moreover, Apple is in the process of designing a wireless Bluetooth earphone, which will be offered as a premium accessory.